May 2023 Summaries

Finite Element Analysis (FEA) is a computational method used to simulate and analyze the behavior of complex physical systems by dividing them into smaller, finite elements, forming a mesh that approximates the system's geometry. This technique involves three main stages: preprocessing, where the system's geometry, material properties, and boundary conditions are set; solution, where mathematical equations are assembled and solved numerically; and post-processing, where results are visualized and analyzed. Developed in the mid-20th century by pioneers like Richard Courant and J. Tinsley Oden, FEA has become integral in fields such as mechanical, civil, aerospace, and automotive engineering due to its flexibility and accuracy in handling complex problems. Although FEA requires significant computational resources and expertise, its ability to model diverse phenomena, such as structural mechanics and fluid dynamics, makes it a valuable tool for optimizing designs and assessing system performance. While FEA and the Finite Element Method (FEM) are often used interchangeably, FEM refers to the mathematical approach, whereas FEA involves the practical application of this method. Despite some limitations, such as simplifying assumptions and sensitivity to input variations, FEA remains a trusted approach for engineering analysis, continually evolving to contribute to advancements across multiple industries.

Rescale is enhancing high-performance computing (HPC) systems for research and engineering by automating the setup and execution of R&D computing tasks, thus accelerating innovation and digital transformation. To address common challenges in HPC operations, Rescale has launched Rescale Labs, an initiative aimed at fostering collaboration and providing new solutions to improve R&D computing efficiency. This includes tools like the Job Analyzer, which monitors cloud hardware utilization to optimize resource use, and Rescale Web Apps, which democratize access to advanced R&D workflows through intuitive, browser-based applications. These tools, which are part of Rescale's internal innovations, are now shared publicly to enhance speed, accuracy, and efficiency on their HPC platform. Rescale is committed to building an open community where customers can engage in testing and co-develop computational tools, with the aim of making HPC more efficient and secure.

The Teratec Forum 2023, held in Paris at the Parc Floral on May 31 and June 1, gathers over 1,000 international experts to discuss advancements in digital simulation, high performance computing (HPC), AI, and quantum computing, emphasizing their importance in modern innovation. Rescale, participating in the forum, will showcase its high-performance computing platform designed for hybrid and multi-cloud strategies, offering features like Software Publisher, Files, and Performance Profiles. Rescale's technical director, Romain Klein, will present a workshop on supercomputing architecture trends, highlighting flexible computing methods and the use of large-scale IT infrastructures for parallel computations. The forum also encourages exploring nearby Paris attractions such as the Jardin Botanique, Chateau de Vincennes, and Bercy Village, enriching the attendee experience.

Rescale, a leader in high performance computing (HPC) for the cloud, has achieved the Amazon Web Services (AWS) Manufacturing and Industrial Competency, highlighting its expertise in delivering a comprehensive HPC platform for industrial manufacturing processes. This designation distinguishes Rescale as an AWS Partner Network member with demonstrated technical proficiency and customer success in implementing AWS cloud technologies for the manufacturing sector. By providing cutting-edge HPC and AI solutions, Rescale helps manufacturing and industrial customers accelerate product development, streamline design iterations, and reduce costs, thereby enhancing their competitiveness. The AWS Competency Program aids customers in identifying partners with industry-specific expertise, and Rescale's platform empowers users to handle data-intensive digital simulations and apply AI to research and development. This achievement underscores Rescale's commitment to supporting digital transformation in manufacturing, as noted by Ethan Rasa, the company’s Vice President of Global Technology Alliances, and is exemplified by its collaboration with Exosonic in designing supersonic aircraft.

Research and development teams are leveraging cloud computing, open-source software, and specialized hardware to enhance their simulation, modeling, and analysis capabilities, creating new management challenges as they expand their software portfolios. The rise of custom software is driven by organizations seeking to harness their proprietary data and methods for competitive advantage, offering cost-effective alternatives to commercial applications while capitalizing on advancements in hardware to boost performance. However, managing this software sprawl poses difficulties, necessitating efficient deployment and governance strategies to ensure security, compliance, and cost control. Rescale addresses these challenges with its Software Publisher, enabling users to self-publish and manage custom R&D software in the cloud, thereby accelerating product commercialization and maintaining centralized oversight of software resources.

Rescale has joined the NVIDIA Partner Network (NPN) as a preferred partner, enhancing its cloud-based high-performance computing (HPC) platform with NVIDIA's advanced GPU-accelerated hardware and AI software solutions. This collaboration, which started in 2019 as part of NVIDIA Inception, allows Rescale to offer its customers improved simulations and AI frameworks on-demand, leveraging NVIDIA's AI Enterprise software stack and H100 Tensor Core GPU. The partnership also provides Rescale with access to NVIDIA's marketing and sales channels, facilitating business expansion. Additionally, Rescale has launched the NVIDIA on Rescale Test Drive program, enabling organizations to trial GPU-accelerated HPC workflows without needing to manage their own hardware or software setups. This alliance comes amid growing demand for HPC and AI across various industries, aiming to address complex challenges by enhancing productivity, lowering energy consumption, and accelerating product development.

Rescale is set to showcase its high-performance computing (HPC) innovations at the Automotive Engineering Exposition 2023 in Yokohama, Japan, an event organized by the Society of Automotive Engineers of Japan that attracts over 40,000 attendees and 500 exhibitors. The exposition will focus on sustainable automotive manufacturing, featuring discussions on recycling, green manufacturing, and building a circular economy. Rescale will highlight its cloud-based HPC solutions, which offer automotive companies increased agility, cost-efficiency, and reduced time-to-market by allowing them to run numerous simulations simultaneously. These cloud services help overcome the limitations of on-premises computing, such as high costs and resource constraints, thereby fostering innovation and competitiveness in the automotive sector. Rescale's presence includes demonstrations and case studies on automotive digital transformation, electric vehicle innovation, and autonomous driving, emphasizing its role in enhancing R&D efforts. Attendees are invited to visit Rescale's booth to explore more about leveraging cloud technology for automotive advancements.

Rescale leverages AI to enhance the speed and efficiency of scientific discoveries and design breakthroughs by providing research and engineering teams with access to advanced cloud-based high-performance computing (HPC) resources. At the BIO-IT World conference in Boston, Rescale will showcase its solutions for modernizing HPC infrastructures, which help expedite drug development and testing while ensuring compliance and cost-effectiveness. The event, organized by the Cambridge Innovation Institute, gathers global experts in biomedical research and technology to explore advancements in precision medicine and offers a comprehensive program including expert speakers, workshops, and networking opportunities. Rescale’s presence at the conference highlights its role in accelerating innovation through scalable computing solutions, addressing the growing demand for dynamic cloud resources to enhance the safety and efficacy of new treatments. Attendees are encouraged to visit Rescale's booth to learn more about their offerings and the potential benefits of transitioning to cloud-based HPC systems.

Modern R&D teams seeking high-performance computing solutions can explore Rescale's offerings at the NAFEMS World Congress 2023 in Tampa, Florida, from May 15-18. This event, hosted by the International Association for the Engineering Modeling, Analysis, and Simulation Community, focuses on digital simulation in product design and features keynotes from leaders at Boeing, MIT, NASA, and others. Rescale, a Gold Sponsor, will present on "Democratizing Computational Engineering and AI-Accelerated R&D in the Cloud" and partner with NVIDIA and Microsoft Azure for discussions on optimizing HPC workloads. Attendees can learn about Rescale's Publisher feature for hosting custom R&D software and enjoy Tampa's attractions, including beaches and historic neighborhoods. Rescale invites participants to visit booth 7 for demos, prizes, and to set up meetings.

Artificial Intelligence (AI) is transforming engineering through innovations like generative design and physics informed neural networks (PINNs), combining deep learning with physics principles to optimize complex problem-solving. AI and machine learning (ML) engineering involve building systems that simulate human intelligence for tasks like natural language processing and decision-making, demanding expertise in computer science, statistics, and software engineering. The convergence of AI with high performance computing (HPC) is enhancing AI's capabilities, enabling faster processing of vast data sets and driving advancements across industries such as healthcare, finance, and automotive. Generative design, especially in HPC, uses algorithms to explore numerous design options, optimizing efficiency, performance, and innovation, while PINNs integrate physics constraints for more accurate predictions in fields like fluid dynamics and mechanics. Although AI is not expected to replace engineers, it complements their work by automating routine tasks and offering new tools, maintaining human creativity and problem-solving as essential components. As AI technologies advance, they will likely become more prevalent, facilitating breakthroughs in engineering and computational science.

Computer-aided engineering (CAE) simulations are essential tools for R&D teams to evaluate design performance before physical prototyping, thus saving time and costs. These simulations are utilized in various fields such as drug discovery, automotive design, and architecture, allowing engineers to optimize products for efficiency, reliability, and safety. Historically rooted in the aerospace and defense industries, CAE has evolved with advancements in computing power, notably through cloud-based solutions like High-Performance Computing as a Service (HPCaaS). This evolution enables more complex simulations, reduces costs, and enhances accessibility by providing scalable computing resources without substantial infrastructure investments. HPCaaS supports more intricate models, allowing faster and more detailed insights, which in turn accelerates innovation and reduces environmental impact by optimizing designs virtually. The shift to cloud-based CAE not only democratizes access to powerful computing resources but also enhances collaboration by enabling remote access, thereby transforming the discipline and expanding its applications across diverse industries.