Autodesk and Rescale Announce Strategic Partnership to Provide Moldflow on Rescale’s Cloud HPC Platform
Blog post from Rescale
Rescale has announced a collaboration with Autodesk to allow users of Autodesk Moldflow software to run their simulations on Rescale's high-performance computing (HPC) platform. This partnership enables Moldflow customers to leverage Rescale's scalable hardware resources, providing an opportunity to enhance simulation efficiency and overcome compute resource bottlenecks. Rescale offers a secure, enterprise-grade, multi-cloud environment with access to customizable HPC resources, including specialty hardware such as InfiniBand and GPUs, across over 30 global data centers. By integrating with Rescale, Autodesk Moldflow users can dynamically scale compute power, execute large-scale Design of Experiments (DOE), and improve the quality and manufacturing of plastic parts. This collaboration reflects Autodesk's commitment to advancing simulation capabilities and provides users with a seamless, web-based application environment to maximize the potential of Moldflow software.
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